We develop MicroLED-based silicon photonics and advanced packaging process technology, and collaborate with domestic and international partners to build a leading AI future.
Enabling ultra-low-power, high-density optical links from chip to chip — the interconnect layer next-generation AI computing needs.
MicroLED array design and light-source technology for high-speed visible-light optical transmission.
Parallel optical links between ICs — targeting the bandwidth and energy efficiency electrical links cannot reach.
Integrating optical engines with compute silicon for dense, low-latency data movement.
Miniaturization, mass-transfer and precision optical-path / fiber-alignment technology.
Heterogeneous integration and panel-level packaging process development.
High-bandwidth visible-light data communication built on our MicroLED platform.
Founded in November 2019 and headquartered in Zhubei, Hsinchu — Taiwan's semiconductor heartland.
Eminence Opt. Technology Co., Ltd. (益銘光電科技股份有限公司) is a deep-tech company advancing silicon-photonics high-speed transmission and advanced-packaging process technology. Our team brings together experience from leading semiconductor fabs, professional IC design houses and OSATs, spanning MicroLED miniaturization, optical-path design, high-speed transmission interfaces, precision optics and advanced packaging. Eminence is backed by strategic industry investors and works with domestic and international partners to realize the optical interconnect that the AI era demands.
For business, partnership and collaboration enquiries.
3F-8, No. 65, High-Speed Rail 7th Rd,
Zhubei City, Hsinchu County 302, Taiwan